• Glass shell diameter: φ1.35mm, glass shell length: 2.00mm, featuring smaller size and more sensitive response;

• High-temperature sintering process ensures excellent stability and high reliability;

• Wide resistance range: 1KΩ ~ 3650KΩ;

• High precision of resistance value and B-value;

• Glass encapsulated design enables application in harsh environments such as high temperature and high humidity;

• Rugged structure, suitable for automated mounting;

• Operating temperature range: -50℃ ~ +350℃;

• Optimized structure with bent diameter (width) ≤ 2.0mm, allowing encapsulation into smaller housings;

• Lead wire diameter: φ0.4mm. The thin and flexible lead wire avoids stress damage to the glass body during bending and mechanical processing, protecting the internal chip and overall structure.

Energy Sector: Used for mounting on circuit boards (FPC flexible boards, PCB rigid boards), such as temperature detection of new energy power batteries and new energy energy storage batteries.

Home Appliances: Temperature control and detection for household appliances including high-temperature food probes, induction cookers, electric pressure cookers, rice cookers, electric ovens, disinfection cabinets, microwave ovens and electric heaters.

Industrial Sector: Temperature control and detection for industrial, medical, environmental protection, meteorological and food processing equipment.

Security Field: Fire alarms, smart electricity meters, intelligent power protection devices, etc.

Medical Field: Clinical thermometers, infant incubators, disinfection equipment, medical bath tanks and other medical devices.

OA Equipment: Printers, copiers, paper shredders, etc.

Automotive & Motorcycle Sector: Temperature control and measurement for automotive water temperature, oil temperature, engine, automotive air conditioning, rearview mirrors, intake and exhaust systems, etc.